using SqlSugar; namespace MES.Service.Modes; /// /// SPI/AOI 检测主表实体,用于保存单块 PCB 的批次检测概览数据。 /// [SugarTable("MES_SPI_AOI_HEADER")] public class MesSpiAoiHeader { /// /// 主键ID,由 Oracle 序列 SEQ_SPI_AOI_HEADER 生成。 /// [SugarColumn(ColumnName = "ID", IsPrimaryKey = true, OracleSequenceName = "SEQ_SPI_AOI_HEADER")] public decimal Id { get; set; } /// /// 测试日期(设备上传的年月日)。 /// [SugarColumn(ColumnName = "TEST_DATE")] public DateTime TestDate { get; set; } /// /// 测试时间(HH:mm:ss 格式,保持原始值)。 /// [SugarColumn(ColumnName = "TEST_TIME")] public string TestTime { get; set; } = string.Empty; /// /// 测试结果原始字符串,例如 0:0:1;0、0;0;0:1、Fail。 /// [SugarColumn(ColumnName = "TEST_RESULT")] public string TestResult { get; set; } = string.Empty; /// /// 检测面(T = Top 顶面,B = Bottom 底面)。 /// [SugarColumn(ColumnName = "SURFACE")] public string Surface { get; set; } = string.Empty; /// /// 计划检测点数。 /// [SugarColumn(ColumnName = "TOTAL_POINTS")] public int? TotalPoints { get; set; } /// /// 实际不良点数。 /// [SugarColumn(ColumnName = "ACTUAL_DEFECTS")] public int? ActualDefects { get; set; } /// /// 设备型号。 /// [SugarColumn(ColumnName = "EQUIPMENT_MODEL")] public string? EquipmentModel { get; set; } /// /// 对应生产工单或批次号。 /// [SugarColumn(ColumnName = "WORK_ORDER")] public string? WorkOrder { get; set; } /// /// 机种名称。 /// [SugarColumn(ColumnName = "PRODUCT_MODEL")] public string? ProductModel { get; set; } /// /// 板件条码(唯一约束)。 /// [SugarColumn(ColumnName = "BOARD_BARCODE")] public string BoardBarcode { get; set; } = string.Empty; /// /// SMT 组别。 /// [SugarColumn(ColumnName = "SMT_GROUP")] public string? SmtGroup { get; set; } /// /// 线别名称。 /// [SugarColumn(ColumnName = "LINE_NAME")] public string? LineName { get; set; } /// /// 创建时间,默认写入数据库时间戳。 /// [SugarColumn(ColumnName = "CREATED_AT")] public DateTime CreatedAt { get; set; } /// /// 更新时间,默认写入数据库时间戳。 /// [SugarColumn(ColumnName = "UPDATED_AT")] public DateTime UpdatedAt { get; set; } }